After years of machine polishing, it was finally time to create our own pads.
We took the characteristics from our favorite pads & created our own.
Our H.E.X polishing pads are designed to optimize your dual action polisher, increasing speed & cutting power.
The unique H.E.X pattern helps retain compound during polishing & lower surface temps, allowing a longer work time, whilst the wedge design utilises the 125mm backing plate, but allows a larger 150mm polishing area.
The slim 25mm pad construction helps to optimize the dual action polishing action, increasing cut.
Our number system helps you select the right pad for the job, see details below:
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